This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlig...

RezensionFrom the reviews:'This book presents to the general public the most important results fr...

(UniversityofHannover,Germany) Audio-VisualChair: J¨orgAbke(UniversityofHannover,Germany) LocalAr...

As Moore's law continues to unfold, two important trends have recently emerged. First, the growth...

InhaltsangabeIntroduction.Part IChapter 1: A Survey of Fine-Grain Reconfigurable ...

This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlig...

This book is the fourth in a series on novel low power design architectures, methods and design p...

This book constitutes the refereed proceedings of the 11th International Symposium on Applied Rec...

This book contains extended and revised versions of the best papers that were p- sented during th...

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system...

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system...